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Manufacturing/Packaging  

Yole sees increasing WLP adoption in ICs

Posted: 26 Feb 2008  Print Version  Bookmark and Share Subscribe

Keywords: wafer-level packaging  WLP technology  CMOS 

[Summary of tips] Yole Dveloppement released an analysis on the adoption of wafer-level packaging (WLP) in semiconductors based on the idea that WLP technology can be implemented in the most cost sensitive applications and will scale favorably with the trend to manufacture on increasing wafer diameters.The French research and strategy company in......
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