Manufacturing/Packaging 
TI bares details of 45nm process
Keywords: 45nm process strained silicon immersion lithography ultra-low K dielectrics
[Summary of tips] Texas Instruments Inc. has revealed that its 45nm process uses strained silicon, immersion lithography and ultralow-k dielectrics to lower power by 63 percent and increase performance by 55 percent compared with its 65nm process, and double the number of chips produced on each 45nm silicon wafer.At this week's International Sol......Please login or register with us to view this article>>
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