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Memory/Storage  

Winbond taps ESI solution for 70nm DRAM

Posted: 11 Jan 2008  Print Version  Bookmark and Share Subscribe

Keywords: 70nm DRAM  link processing  memory IC 

[Summary of tips] Electro Scientific Industries Inc. (ESI) announced that Winbond Electronics Corp. has adopted ultraviolet (UV) laser link processing to enable Winbond's move to 70nm advanced DRAM production.In addition to purchasing a Model 9850UV dual beam semiconductor link-processing system, Winbond is planning to upgrade several of its exi......
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