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Controls/MCUs  

'Chip-on-MEMS' enables wafer-level calibration

Posted: 17 Dec 2007  Print Version  Bookmark and Share Subscribe

Keywords: chip-on-MEMS  ASIC  pressure sensor  automotive market 

[Summary of tips] MEMS chips are currently joined to separate CMOS ASICs after separate wafers are diced. A new technique called "chip-on-MEMS" bonds ASIC dice atop an entire MEMS wafer before dicing, according to developer VTI Technologies Oy."Chip-on-MEMS is a radical step away from conventional packaging," said Heikki Kuisma, VP of research a......
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