Global Sources
EE Times-Asia
 Catch the latest   Vital Signs     Tech Watch     In Asia
EE Times-Asia > T&M
 
 
T&M  

Tessera files new patent complaint before U.S. ITC

Posted: 12 Dec 2007  Print Version  Bookmark and Share Subscribe

Keywords: patent infringement complaint  small-format BGA semiconductor packages  importation 

[Summary of tips] Tessera Technologies Inc. has filed a new patent infringement complaint against several companies with the U.S. International Trade Commission (ITC). Tessera also has filed a concurrent action in the U.S. District Court for the Eastern District of Texas against these same companies. The company is seeking to investigate the unl......
Please login or register with us to view this article>>
 

Article Comments - Tessera files new patent complaint b...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top