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Infineon-Intel team eyes high-density SIM cards
Keywords: HD SIM card Intel Infineon agreement chip solution
[Summary of tips] Infineon Technologies AG and Intel Corp. are working together for the development of optimized chip solutions for high-density (HD) SIM cards. Under the terms of the agreement, Infineon will architect modular chip solutions with Intel offering memory capacities from 4-64Mbytes. Infineon will develop a 32bit security MCU based o......Please login or register with us to view this article>>
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