Manufacturing/Packaging 
Through-hole tech shrinks camera modules for handsets
Keywords: though-hole technology camera module W-CSP
[Summary of tips] Oki Electric Industry Co. Ltd has started a contract assembly service for wafer-level chip sized package (W-CSP) semiconductors using through-hole technology that allows sensor and camera module manufacturers to obtain camera modules half the size of conventional modules.In order to miniaturize a camera module, it is necessary ......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
Article Comments - Through-hole tech shrinks camera mod...
Visitor0530
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is anything on this year's Best of Innovations Design and Engineering Award list!
Search EE Times Asia
Peek at Hot Gadgets for 2012
