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EDA's big three unready for 3D chip packaging

Posted: 25 Oct 2007  Print Version  Bookmark and Share Subscribe 

Keywords:EDA  3D layout  chip packaging 

[Summary of tips] IMEC is putting a renewed emphasis on chip packaging—and on 3D-integration in particular—according to plans revealed at a press briefing before last week's Annual Research Review Meeting. However, IMEC and European chip company experts are not expecting much help to come from the "big three" EDA companies—usua......
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