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Industrial affiliation program tackles 32nm IC packaging
Keywords: flip-chip substrate technology packaging interconnect issues low-k materials
[Summary of tips] Two research centers are inviting industry partners to participate in an advanced research program on next-generation flip-chip and substrate technologies. The effort will address key "IC-to-package-to-board" packaging interconnect issues for 32nm ICs and below.The Microsystems Packaging Research Center at the Georgia Institute......Please login or register with us to view this article>>
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