Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Challenges & Opportunities 2011   MCU   MEMS   IGBT   processor   LED   RFID
EE Times-Asia > RF/Microwave
 
 
RF/Microwave  

Broadcom packs key 3G technologies in one chip

Posted: 17 Oct 2007  Print Version  Bookmark and Share Subscribe

Keywords: 3G  CMOS  65nm HSPA chip 

[Summary of tips] Broadcom Corp. has announced a new single-chip high-speed packet access (HSPA) processor that integrates all key 3G cellular and mobile technologies on a single low-power 65nm CMOS die. The BCM21551, dubbed a "3G phone-on-a-chip" solution, enables manufacturers to build next-generation 3G HSUPA phones with innovative features, ......
Please login or register with us to view this article>>
 

votes:   Add to Favorites
Seamless-switching mobile TV chip ti...
MMICs address needs of test & measur...
Article Comments - Broadcom packs key 3G technologies i...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top