Amplifiers/Converters 
Thermal pillar copper tech helps cool flip-chips
Keywords:flip-chips thermal copper pillar bumps thermal power management
[Summary of tips] Nextreme Inc. claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps. The technology embeds a thermoelectric cooler into each bump, which can either help cool chips, or can be used in reverse to generate energy from waste heat."Over the last decade, thermal power management has......Please login or register with us to view this article>>
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