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NXP picks CEVA DSP core for ULCH solutions

Posted: 11 Oct 2007  Print Version  Bookmark and Share Subscribe

Keywords: ULC handset  DSP core  single-chip solution 

[Summary of tips] NXP Semiconductors has selected CEVA Inc.'s CEVA-Teak DSP core for its highly integrated ultralow-cost (ULC) single-chip solutions targeting low-cost and entry-level handset designs for emerging markets.Leveraging the processing performance and low power of the CEVA-Teak DSP core for baseband and voice processing, NXP's ULC sin......
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