EDA/IP 
Designing in the age of 3D systems
Keywords: 3D stacking 3D multipackage solutions 3D EDA tools
[Summary of tips] By Charles White, Tessera Inc. David Seeger, IBM ResearchThis is just the beginning of the 3D revolution.Market research firm Prismark Partners estimates that more than 1.4 billion 3D packages were produced in 2005. Over time, however, current 3D components—predominantly die-stacked and package-stacked devices—will ......Please login or register with us to view this article>>
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