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Applying CTMs on FPGA-based devices
Keywords: thermal concerns IC design predict temperature faster denser FPGA FPGA component temperature
[Summary of tips] Deep-submicron IC design takes advantage of reduced feature sizes to increase transistor density and performance, thus resulting in thermal concerns. When power consumption is high and thermal budget margins are low, designers cannot afford inaccurate temperature predictions. Flip-chip packages used in high-performance FPGAs ha......Please login or register with us to view this article>>
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