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IBM gets on the road to 3D packaging

Posted: 01 Jun 2007  Print Version  Bookmark and Share Subscribe

Keywords: 3D packaging  Big Blue  through-silicon vias 

[Summary of tips] News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging. This emerging style of silicon design promises advances in performance, power and cost for a broad array of systems.In 2008, Big Blue will sel......
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