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X-ray inspection system delivers high-throughput 3D coverage

Posted: 30 Apr 2007  Print Version  Bookmark and Share Subscribe

Keywords: X-ray inspection system  PCB assembly  3D coverage 

[Summary of tips] Agilent Technologies says its Medalist x6000 3D X-ray inspection systems offer more than double the throughput of leading 3D solutions while using full 3D capability to find PCB assembly (PCBA) solder and manufacturing assembly defects.The increased throughput of the Medalist x6000 offers two key benefits, said the company. Fir......
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