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Akita Elpida claims densest multichip package
Keywords: stacked die MCP densest MCP die Akita Elpida MCP
[Summary of tips] Akita Elpida Memory Inc. said it has developed the world's densest multichip package (MCP) with 20 stacked die in a package 1.4mm in thickness.To achieve the high density, Akita Elpida explained that it used grinding technology to produce individual die that are 30nm thick and developed handling technology for such thin die. Th......Please login or register with us to view this article>>
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