Global Sources
EE Times-Asia
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 
EE Times-Asia > Networks
 
 
Networks  

New tech pares down I/O power draw

Posted: 02 Apr 2007  Print Version  Bookmark and Share Subscribe

Keywords: Serdes transceiver  interconnect standards  high-speed Serdes 

[Summary of tips] Rambus Inc. and a group of leading academics have set a high-water mark in bringing fast chip-to-chip links into the era of low-power design. Their advance suggests the industry needs to rethink some fundamental assumptions in the way it defines, measures and implements power in interconnect designs.At the International Solid-S......
Please login or register with us to view this article>>
 
 

Wi-Fi/Bluetooth combos flood market
PoE in security systems
Article Comments - New tech pares down I/O power draw
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top