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Sematech, TEL advance work on 3D interconnects
Keywords: Sematech TEL 3D interconnect technology
[Summary of tips] Sematech and Tokyo Electron Ltd (TEL) entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advance manufacturing. Sematech and TEL engineers will collaborate on two separate projects—first, a three-year effort to transcend the barriers ......Please login or register with us to view this article>>
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