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Manufacturing/Packaging  

Sematech, TEL advance work on 3D interconnects

Posted: 31 Jan 2007  Print Version  Bookmark and Share Subscribe

Keywords: Sematech  TEL  3D interconnect technology 

[Summary of tips] Sematech and Tokyo Electron Ltd (TEL) entered into a multi-year joint development program to improve the use of 3D interconnect technology and high mobility channel materials in advance manufacturing. Sematech and TEL engineers will collaborate on two separate projects—first, a three-year effort to transcend the barriers ......
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