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Manufacturing/Packaging  

China faces bumpy road to 300mm

Posted: 16 Jan 2007  Print Version  Bookmark and Share Subscribe

Keywords: 300mm fab  wafer  China's chip industry  semiconductor  IC 

[Summary of tips] The outlook for China's chip industry clouded after a Hua Hong NEC affiliate announced in December it would shelve plans for a 300mm wafer fab and instead build a 200mm line. The announcement, ending months of speculation, further deflated expectations for expanded China chipmaking.The change in plan is a minor setback for Chin......
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