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Manufacturing/Packaging  

Encapsulant suits image sensor assembly

Posted: 03 Jan 2007  Print Version  Bookmark and Share Subscribe

Keywords: image sensor  encapsulant  NCP underfill  Henkel  non-conductive paste 

[Summary of tips] Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said to provide excellent adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.Like other ......
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