Manufacturing/Packaging 
Encapsulant suits image sensor assembly
Keywords: image sensor encapsulant NCP underfill Henkel non-conductive paste
[Summary of tips] Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said to provide excellent adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.Like other ......Please login or register with us to view this article>>
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