T&M 
Samsung piles chips for thin MCPs
Keywords: multichip packages MCPs NAND flash multimedia mobile phones MP3 players
[Summary of tips] Samsung SSD caching solution 'eliminates delays' in Windows Vista PCs" target=_blank>Samsung Electronics Co. is touting an advanced packaging technology that piles 16 chips on top of each other but maintains a height—if one could call it that—of only 1.4mm. There isn't any immediate demand for packages with that man......Please login or register with us to view this article>>
|
Not yet registered?
 Register FREE to view unlimited features, tutorials and products, and enable any content alert service! |
Registered already? Login to view complete content.
|
| Related Articles | Editor's Choice |
Article Comments - Samsung piles chips for thin MCPs
Visitor0530
(To avoid code verification, simply login or register with us. It is fast and free!)
Top Ranked Articles
Christmas Wishlist
All I want for Christmas is anything on this year's Best of Innovations Design and Engineering Award list!
Search EE Times Asia
Peek at Hot Gadgets for 2012
