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Samsung piles chips for thin MCPs

Posted: 01 Jan 2007  Print Version  Bookmark and Share Subscribe

Keywords: multichip packages  MCPs  NAND flash  multimedia mobile phones  MP3 players 

[Summary of tips] Samsung SSD caching solution 'eliminates delays' in Windows Vista PCs" target=_blank>Samsung Electronics Co. is touting an advanced packaging technology that piles 16 chips on top of each other but maintains a height—if one could call it that—of only 1.4mm. There isn't any immediate demand for packages with that man......
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