Global Sources
EE Times-Asia
 Challenges & Opportunities 2011   MCU   MEMS   IGBT   processor   LED   RFID
EE Times-Asia > RF/Microwave
 
 
RF/Microwave  

Design for balun integration in RF LDMOS

Posted: 01 Dec 2006  Print Version  Bookmark and Share Subscribe

Keywords: Freescale  baluns  LDMOS ICs  RF LDMOS  power amplifiers 

[Summary of tips] This article deals with LDMOS IC substrate specifics and balun design challenges, and presents two successful designs and the associated measurement data.View the PDF document for more information.
 

Article Comments - Design for balun integration in RF L...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Christmas Wishlist
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top