Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Catch the latest   Vital Signs     Tech Watch     In Asia
EE Times-Asia > T&M
 
 
T&M  

Wire-bondable devices come in silicon and ceramic

Posted: 24 Nov 2006  Print Version  Bookmark and Share Subscribe

Keywords: TT electronics  IRC  Advanced Film Division  WBC  resistors 

[Summary of tips] TT electronics IRC Advanced Film Division has developed a comprehensive range of surface-mount wire bondable devices. Designated the WBC series, the family consists of resistors, network arrays, capacitors, multitap chip resistors and divider networks on silicon and ceramic.According to Debasis Roy, thin film business unit dire......
Please login or register with us to view this article>>
 

votes:   Add to Favorites
Clear Shape solution promises fast D...
DAQ module features hot-plug functio...
Article Comments - Wire-bondable devices come in silico...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top