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Outsourced IC packaging to reach $13.1B
Keywords: Research and Markets outsourced packaging BGA CSP FC
[Summary of tips] The market scale of outsourced IC packaging is estimated to reach $13.1 billion this year, with Taiwan gradually emerging as a powerhouse in the industry segment, according to a Research and Markets report.As international IDMs speed up outsourced processing worldwide, CAGR for the segment will reach 168 percent between 2003 an......Please login or register with us to view this article>>
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