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Group meets to promote adoption of WLCSP semicon

Posted: 07 Nov 2006  Print Version  Bookmark and Share Subscribe

Keywords: Wafers  semiconductors  semicons  semicon  IC packaging 

[Summary of tips] The first meeting of the Wafer Level chip-scale package (WLCSP) Forum was held last week in San Jose, California and discussed several issues pertinent to the forum's objectives.Composed of designers, marketers, manufacturers and suppliers, the group aims to promote adoption of WLCSP semiconductor devices in high-volume consume......
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