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Test challenges could trump future chip designs
Keywords: Robert Daasch chip tests Tets Maniwa
[Summary of tips] Coming silicon process generations will bring not only immense increases in device density, but also the challenges of working with process and device variations that in many ways are worse than for the processes of 20 years ago, said Robert Daasch, professor of electrical and computer engineering at Portland State University.I......Please login or register with us to view this article>>
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