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Sigrity unveils new IC package characterization suite
Keywords: Sigrity SpeedPKG Suite XtractIM IBIS SPICE
[Summary of tips] Promising a new suite of tools that will enable "fast, easy, accurate and complete" IC package characterization, Sigrity Inc. this week is releasing its SpeedPKG Suite. Its first member is XtractIM, which helps package design teams address electrical performance issues.XtractIM is aimed at package design engineers who need to p......Please login or register with us to view this article>>
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