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3D interconnects transmit at 100Gbps
Keywords: NEC Electronics Smafti 3D interconnections packaging Han Park
[Summary of tips] NEC Electronics has a wafer-level packaging technology that the company said permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.The connections can support transmissions of up to 100Gbps with reduced power consumption, the company claimed.The approach may be used in ......Please login or register with us to view this article>>
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