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Tech bonds different material-based elements without wire bonding
Keywords: Oki Electric Industry interconnect technology interconnect tech wire bonding Epi Film Bonding
[Summary of tips] Oki Electric Industry Co. Ltd announced a new interconnect technology that allows bonding of different material-based device elements without using conventional wire bonding.Named Epi Film Bonding (EFB), the intermolecular bonding technology exfoliates a device element grown on a substrate and bonds the thin film on a different......Please login or register with us to view this article>>
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