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New dice interconnects support up to 100Gbps
Keywords: NEC Electronics Smafti 3D interconnections David Lammers
[Summary of tips] NEC Electronics has a wafer-level packaging technology that it says permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.The connections can support transmissions of up to 100Gbps, with reduced power consumption, the company claims.The approach may be used in high-end ......Please login or register with us to view this article>>
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