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Solution enables high-speed 25μm backside wafer coating

Posted: 18 Aug 2006  Print Version  Bookmark and Share Subscribe

Keywords: DEK  backside wafer coating process 

[Summary of tips] DEK recently announced it has developed a next-generation equipment and tooling package that enables the coating of wafers with ultrathin die attach materials down to 25μm in thickness.Traditional dispensing methods and paste die attach processes have manufacturing challenges such as the inability to achieve emerging units......
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