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SiP tech stacks logic, gigabit-class memory in one package

Posted: 03 Aug 2006  Print Version  Bookmark and Share Subscribe

Keywords: NEC Corp.  NEC Electronics Corporation  SiP  SMAFTI 

[Summary of tips] NEC Corp., NEC Electronics Corp. and NEC Electronics America Inc. unveiled a new system-in-package (SiP) technology capable of stacking logic and gigabit-class memory in a single package to enable high-speed, high-definition image processing in mobile devices.The new SiP technology—SMArt connection with Feed-Through Inter......
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