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Freescale cuts die area, thickness with new chip packaging tech
Keywords: Freescale Semiconductor redistributed chip packaging XX XX XX
[Summary of tips] In an industry obsessed with miniaturization, Freescale Semiconductor Inc. has high hopes for a packaging technology that could radically alter the way chipsets are deployed.A proprietary technique called redistributed chip packaging (RCP) delivers about a 30 percent reduction in packaged-die area and thickness, said executives......Please login or register with us to view this article>>
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