Manufacturing/Packaging 
AC process streamlines Pb-free flip-chip assembly
Keywords: Henkel non-conductive paste encapsulant Hysol FP5000 Hysol FP5001
[Summary of tips] The electronics group of Henkel has introduced a new process, designated as Accelerated Cooling (AC), to be used in combination with the company's two flip-chip in package non-conductive paste (NCP) underfill encapsulants, which is said to reduce warpage, eliminate voids and cut cycle time in the lead-free flip-chip assembly pr......Please login or register with us to view this article>>
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