Manufacturing/Packaging 
New wafer bonding system targets advanced MEMS
Keywords: SUSS M-Lock wafer bonding system
[Summary of tips] SUSS MicroTec has unveiled the M-Lock, a wafer bonding system designed for high vacuum applications. The system will be available in Q3 2006. Touted to be an industry-first, this field upgradeable load locked wafer bonding system was developed by SUSS MicroTec for advanced MEMS devices that require ultra clean, low moisture and......Please login or register with us to view this article>>
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