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Manufacturing/Packaging  

Circuit material offers performance, low cost

Posted: 03 Jul 2006  Print Version  Bookmark and Share Subscribe

Keywords: Rogers  RO4450B-dx bondply  high-frequency circuit material 

[Summary of tips] Rogers Corp. will be introducing its new RO4450B-dx bondply, a high fill/flow version of the company's industry-standard RO4450B high-frequency circuit material, at the 2006 European Microwave Week in September.According to the company, the new circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designe......
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