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Philips unrolls new ultra-thin leadless packages
Keywords: Philips Logic RF MicroPak II SOD882T
[Summary of tips] Royal Philips Electronics has announced two new packages for Logic and RF applications--the MicroPak II and SOD882T—touted to be breakthrough products in ultra-thin leadless packaging.MicroPakII is said to be the worlds smallest leadless Logic package at a size of 1mm2, with a pad pitch of 0.35mm. The SOD882T for RF appl......Please login or register with us to view this article>>
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