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FlipChip, Engent to develop 3D wafer level CSP tech

Posted: 31 May 2006  Print Version  Bookmark and Share Subscribe

Keywords: 3D wafer level CSP  stacked die packaging  FlipChip  Engent 

[Summary of tips] FlipChip International and Engent announced an alliance aimed at accelerating the development and deployment of 3D wafer level CSP technologies for stacked die packaging applications. This technology could enable packaging solutions that are quicker to market and cheaper than SoC alternatives.The partnership combines FCI's wafe......
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