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Manufacturing/Packaging  

Yamato unveils N2 reflow oven for 200-300mm wafers

Posted: 31 May 2006  Print Version  Bookmark and Share Subscribe

Keywords: Yamato  NRY-130V6W/LU  nitrogen reflow oven 

[Summary of tips] Yamato Works Co. Ltd has rolled out the NRY-130V6W/LU nitrogen reflow oven for solder bump forming for 200-300mm wafers.This equipment's heating system employs a combination of the hot plate and the upper far-infrared heater. The hot plate uses the pins-supported heating mechanism to take in warped wafer. Maximum temperature fo......
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