Controls/MCUs 
Engineers develop cooling device for computer IC
Keywords: John Walko
[Summary of tips] Engineers at Purdue University have developed a MEMS-based micro-pump cooling device small enough to fit on a computer chip that circulates coolant through channels etched into the chip.The device has been integrated on to a silicon chip that is about 1cm2. The prototype contains numerous water-filled micro-channels, grooves ab......Please login or register with us to view this article>>
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