Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 Challenges & Opportunities 2011   HDTV   PCIe   HDMI   sensor   WiMAX
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

New material eases thermal management

Posted: 22 Mar 2006  Print Version  Bookmark and Share Subscribe

Keywords: Honeywell PCM45F-SP  phase-change material  thermal management  Honeywell Electronic Materials 

[Summary of tips] Honeywell Electronic Materials has announced the release of a new screen-printable phase-change material that aims to provide semiconductor chip manufacturers flexibility in thermal management.According to the company, manufacturers have been limited by the shape of phase-change materials supplied in traditional tape formats. T......
Please login or register with us to view this article>>
 

votes:   Add to Favorites
Bondply targets multilayer PCBs
Techspray swab tests for lead
Article Comments - New material eases thermal managemen...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Top Ranked Articles
High-quality Articles
Christmas Wishlist
    Kindle Fire Hot CE innovations at the CES

    All I want for Christmas is any of this year's Best of Innovations Design and Engineering Award honorees! Here's the EE Times pick for Top 10 CE gadgets.

Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top