Global Sources
EE Times-Asia
Advanced Search
News
Products
Technical Articles
App Notes
ForumBlogsWhite PapersDatasheetsWebinars
 
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Green semiconductor packaging: Addressing the environmental concerns of the 21st century

Posted: 01 Feb 2006  Print Version  Bookmark and Share Subscribe

Keywords: IDT  Integrated Device Technology  Phil Bourekas  electronics  environmental 

[Summary of tips] No development can proceed without closely examining the environmental impact of using a product and its compliance with global environmental regulations.View the PDF document for more information.
 

votes:   Add to Favorites
Green IC packaging addresses environ...
Getting the lead out
Article Comments - Green semiconductor packaging: Addre...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Search EE Times Asia
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

Go to top