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Sensors/MEMS  

Camera module eases upgrade to 3 megapixels

Posted: 21 Feb 2006  Print Version  Bookmark and Share Subscribe

Keywords: OV3630DZL  CameraChip  camera module  OmniVision  Gina Roos 

[Summary of tips] OmniVision Technologies Inc. rolled out its OV3630DZL stacked die CameraChip solution at the 3GSM World Congress. Offering a drop-in solution, the device enables handset designers to upgrade camera phones from 2 to 3 Megapixels (MP) without mechanical design changes.The OV3630DZL is a stacked die camera module design with a 1/3......
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