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New wafer-level package tech from National
Keywords: National Semiconductor micro SMDxt micro Surface Mount Device extended technology chip package
[Summary of tips] National Semiconductor Corp. announced the micro SMDxt (micro Surface Mount Device extended technology) chip package, its newest generation of wafer-level package technologies.The new package, which builds on the company's micro SMD, uses a "unique" structure that enables high-reliability products with bump counts of 42 to 100 ......Please login or register with us to view this article>>
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