Global Sources
EE Times-Asia
 
 
T&M

STATS ChipPAC offers copper process for passives

Posted: 24 Nov 2005  Print Version  Bookmark and Share Subscribe

Keywords: singapore  stats chippac  packaging  copper process  ipd 

[Summary of tips] Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems.Responding to market pressure to optimize size, performance and cost of wireless......
Please login or register with us to view this article>>
 
 

Article Comments - STATS ChipPAC offers copper process ...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."