T&M
STATS ChipPAC offers copper process for passives
Keywords: singapore stats chippac packaging copper process ipd
[Summary of tips] Singaporean test and packaging service provider STATS ChipPAC Ltd has qualified a copper process for integrated passive devices (IPD) that the company claims delivers superior performance and miniaturization in radio frequency (RF) wireless systems.Responding to market pressure to optimize size, performance and cost of wireless......Please login or register with us to view this article>>
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