Manufacturing/Packaging 
New QFN/DFN package from AIT
Keywords: Advanced Interconnect Technologies ait QFN DFN package
[Summary of tips] Advanced Interconnect Technologies (AIT) announced the availability of a new ultra-thin QFN/DFN package that features a package thickness of 0.60mm, making it a suitable solution for todays ever shrinking consumer electronics. According to AIT, the lower profile allows for board space reduction, package efficiency in the z-dir......Please login or register with us to view this article>>
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