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EDA/IP  

Implement stacked package-on-package designs

Posted: 17 Oct 2005  Print Version  Bookmark and Share Subscribe

Keywords: amkor technology  package on package stack  pop  package stackable very thin fine pitch ball grid array  substrate 

[Summary of tips] Companies must adopt PoP standards to better plan product road maps and facilitate the adoption of new applicationsView the PDF document for more information.
 

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